Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects

Abstract

With the development of intelligent electronic products, usage of fine-pitch interconnects has become mainstream in high performance electronic devices. Electrochemical migration (ECM) of interconnects would be a serious reliability problem under temperature, humidity and biased voltage environments. In this study, ECM behavior of nanopaste Ag interconnects with pitch size from 20 μm to 50 μm was evaluated by thermal humidity bias (THB) and water drop (WD) tests with deionized water through in situ leakage current-versus-time (CVT) curve. The results indicate that the failure time of ECM in fine-pitch samples occurs within few seconds under WD testing and it increases with increasing pitch size. The microstructure examination indicated that intensive dendrite formation of Ag through the whole interface was found to bridge the two electrodes. In the THB test, the CVT curve exhibited two stages, incubation and ramp-up; failure time of ECM was about 173.7 min. In addition, intensive dendrite formation was observed only at the protrusion of the Ag interconnects due to the concentration of the electric field at the protrusion of the Ag interconnects.