Abstract
In the electrochemical migration behavior (ECM) of printed circuit boards containing mold under a static magnetic field (SMF), the role of the field perpendicular to the electrodes is discussed; the B field inhibits the growth and metabolism of mold, while controlling electrochemical diffusion and nucleation. The field indirectly affects the function of mold as a transmission bridge between two electrodes. In this work, the water drop test was used to simulate the adhesion and growth of mold on the circuit board in a humid and hot environment; confocal laser scanning microscopy, scanning electron microscopy, energy dispersive spectroscopy, Raman spectra, and a scanning Kelvin probe were used to analyze the mechanism of static magnetic field and mold on the electrochemical migration.
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