Electrochemical migration behavior between Cu and Ag under a thin electrolyte layer containing chloride

Abstract

PurposeThe purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag under an NaCl thin electrolyte layer (TEL).Design/methodology/approachA self-made experimental setup for the ECM behavior between Cu and Ag was designed. An HD video measurement microscopy was used to observe the typical dendrite/corrosion morphology and pH distribution. Short-circuit time (SCT), short-circuit current density and the influence of the galvanic effect between Cu and Ag on their ECM behavior were studied by electrochemical tests. The surface morphology and composition of dendrite were characterized by FESEM/EDS.FindingsThe SCT increased with increasing NaCl concentration but decreased with increasing applied bias voltage, and the SCT between Cu and Ag was less than that between Cu and Cu because their galvanic effect accelerated the dissolution and migration of Cu. When NaCl concentration was less than or equal to 6 mmol/L, cedar-like dendrite was formed, whereas no dendrite formed and only precipitation occurred at high chloride ion concentration (100 mmol/L). The composition of the dendrite between Cu and Ag was copper.Research limitations/implicationsThe significance of this study is to clarify the ECM failure mechanism of printed circuit board (PCB) with an immersion silver surface finish (PCB-ImAg).Practical implicationsThis study provides a basic theoretical basis for the selection of protective measures and metal coatings for PCB.Social implicationsThe social implication of this study is to predict the service life of PCB.Originality/valueThe ECM behavior of dissimilar metals under a TEL was investigated, the influence of the galvanic effect between them on their ECM was discussed, and the SCT increased with increasing NaCl concentration.