Electrochemical migration behavior of copper under a thin distilled water layer

Abstract

Electrochemical migration behavior of copper under a thin distilled water layer (TDWL) was explored by electrochemical and surface characterization. It demonstrates that electrochemical migration of copper can occur under a TDWL. The short-circuit time caused by copper dendrites increases with TDWL thickness. It is attributed to the acceleration of hydroxyl ion migration caused by the increasing TDWL thickness, which inhibits migration of copper ions due to the formation of Cu(OH)2. The short-circuit time decreases with applied bias voltage, which originates from the acceleration of copper dissolution.