Abstract
Electrochemical impedance measurements were performed on copper bath solutions during copper deposition and subsequent aging of the bath. The results show a correlation between the low-frequency capacitive loop of the electrochemical impedance and copper deposit roughness. The deposit became smoother as the bath aged and reached an optimal value, after which the deposit became rougher. The optimal surface smoothness correlated with a minimum in the low-frequency capacitive loop diameter of the impedance. The results suggest that electrochemical impedance measurements may be used to monitor changes in the copper bath that affect copper deposit quality and superfilling capability.
Published Version
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