Electrochemical etching of AlGaN for the realization of thin-film devices

Michael A Bergmann,Björn Wickman,Filip Hjort,Rinat Yapparov,Tim Wernicke,Johannes Enslin,Michael Kneissl,Åsa Haglund,Saulius Marcinkevičius

doi:10.1063/1.5120397

Abstract

Heterogeneously integrated AlGaN epitaxial layers will be essential for future optical and electrical devices like thin-film flip-chip ultraviolet (UV) light-emitting diodes, UV vertical-cavity surface-emitting lasers, and high-electron mobility transistors on efficient heat sinks. Such AlGaN-membranes will also enable flexible and micromechanical devices. However, to develop a method to separate the AlGaN-device membranes from the substrate has proven to be challenging, in particular, for high-quality device materials, which require the use of a lattice-matched AlGaN sacrificial layer. We demonstrate an electrochemical etching method by which it is possible to achieve complete lateral etching of an AlGaN sacrificial layer with up to 50% Al-content. The influence of etching voltage and the Al-content of the sacrificial layer on the etching process is investigated. The etched N-polar surface shows the same macroscopic topography as that of the as-grown epitaxial structure, and the root-mean square roughness is 3.5 nm for 1 μm×1 μm scan areas. Separated device layers have a well-defined thickness and smooth etched surfaces. Transferred multi-quantum-well structures were fabricated and investigated by time-resolved photoluminescence measurements. The quantum wells showed no sign of degradation caused by the thin-film process.

Highlights

Until now, most substrate removal attempts for AlGaN-based optical devices have focused on laser induced lift-off
We demonstrate an electrochemical etching method by which it is possible to achieve complete lateral etching of an AlGaN sacrificial layer with up to 50% Al-content
Thermal decomposition of GaN is an established process, but a GaN sacrificial layer does not allow for the growth of AlGaN device layers on top with a high crystalline quality due to the lattice mismatch, leading to cracking of the AlGaN layer5 and strongly limiting the aluminum content and layer thickness

Summary

Introduction

Most substrate removal attempts for AlGaN-based optical devices have focused on laser induced lift-off. We demonstrate an electrochemical etching method by which it is possible to achieve complete lateral etching of an AlGaN sacrificial layer with up to 50% Al-content.

Results

Conclusion