Abstract
The microstructure, composition, semiconductive properties and electrochemical performance of passive film formed on the surface of Ti-6Al-4 V alloy produced by electron beam melting (Abbreviated as ET) were compared with conventional wrought counterpart (WT) in phosphate buffered saline at 37 °C. The results demonstrated a thinner and more compact passive film formed on ET, which was attributed to the small grain size and high density of grain boundaries in ET, these active sites increased the growth rate at the initial stage in the manner of 3D progressive nucleation mechanism of passive film, leading to superior corrosion resistance than WT.
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