Abstract
The electrochemical behavior of aluminum in chemical mechanical polishing (CMP) slurry was investigated using potentiodynamic polarization measurement and electrochemical impedance spectroscopy. The slurry used was mainly composed of phosphoric acid, citric acid, and 50 nm particles. The effects of slurry flow and contact pressure on the electrochemical behavior of Al were explored. The roles of chemical and mechanical interaction on the removal rate of Al during CMP were also attempted. The results showed that the corrosion potential decreased with increasing contact pressure and platen rotating speed. The dissolution rate, which was in reversing proportion to the polarization resistance, also increased with increasing the contact pressure and platen rotating speed. The repeated passivation, film breakdown due to mechanical abrasion, and metal dissolution steps took place during the simulating CMP process. The passive film formed in the testing slurry consisted of , , and . © 2000 The Electrochemical Society. All rights reserved.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
