Abstract

N 2 + implantation was performed into sputter-cleaned Al and anodically oxidized Al samples (3 nm < d oxide <50 nm). The energies of the N 2 + ions ranged between 3 and 200 keV using doses between 2 × 10 15 and 1.8 × 10 18 N 2 + cm −2. Changes in surface conductivity and anodic behaviour were observed after 3 keV implantation of 2 × 10 17 N 2 + cm −2 as studied by electrochemical methods and X-ray photoelectron spectroscopy (XPS). Radiation effects, such as AlN formation and gaseous nitrogen inclusions within the oxide, were monitored in situ after low energy implantation. AlN formation by reactive implantation from the oxide was only observed after a reactive Al 2O 3− x surface was produced by the N 2 + ion beam.

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