Abstract
High electrical and thermal conductivity are beneficial to the shape recovery performance of electroactive shape memory polymer composites. In this work, the chopped carbon fiber (CCF) was processed into silver plated chopped carbon fiber (Ag/CCF), and the Ag/CCF was filled into hydrogenated bisphenol A epoxy (H-EP) resin to fabricate the electro-induced shape memory polymer composites. The Ag/CCF/H-EP composites show good electrical and thermal conductivity compared to the CCF/H-EP composites. When the content of Ag/CCF reaches 1.8 wt%, the e Ag/CCF/H-EP composites reach the threshold of thermal conductivity, electrical conductivity and percolation. The thermal conductivity of H-EP composite with 5.4 wt% Ag/CCF is 2.33 W/(m·K), which is 2.6 times and 12 times of that of CCF/H-EP composite and H-EP matrix, respectively. When the content of Ag/CCF reaches 7.2 wt%, the volume resistivity of Ag/CCF/H-EP composites decrease from 1.69 × 1016 Ω·to 9.51 × 103 Ω cm, and surface resistivity from 6.91 × 1015 Ω to 6.19 × 102 Ω, respectively. And the Ag/CCF/H-EP composites show good mechanical properties and dynamic thermomechanical properties. When the content of Ag/CCF is more than 1.8 wt%, the Ag/CCF/H-EP composites exhibit excellent electroactive shape memory performance, and the shape recovery rate of the composites is more than 92%.
Highlights
Shape memory polymers (SMPs) are a class of intelligent response materials that have developed rapidly in recent years
The diffraction peak of carbon appears at 2θ = 25.56◦, which is not observed in the diffraction characteristic peak of silver plated chopped carbon fiber, further indicating that the surface of CCF has been completely coated with Ag
A novel electrically responsive shape memory polymer composite constituted by Ag/CCF and hydrogenated bisphenol A epoxy (H-EP) was successfully developed
Summary
Shape memory polymers (SMPs) are a class of intelligent response materials that have developed rapidly in recent years They are able to temporarily transform their shapes and return to permanent shapes with appropriate stimulation, such as temperature, electrical, magnetic fields, light, moisture, solvent, pH, etc. (Lu et al, 2015b; Liu et al, 2017; Wang et al, 2017a; Zhang and Serpe, 2017; Zheng and Xie, 2017; Mittal et al, 2018; Yao et al, 2018a) This memory property provides huge opportunities for SMP applications in areas such as smart biomedical materials, smart textiles, sensors and drives, information carriers and aerospace (Lu et al, 2014a; Leng et al, 2015; Yao et al, 2015; Boyraz et al, 2018; Liu et al, 2018; Persson et al, 2018; Du et al, 2019; Kim et al, 2019). The shape recovery temperature of shape memory epoxy can be adjusted within a certain range, and shape memory epoxy with different Tg can be prepared by compounding
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