On the Use of Silver Plated Nano Aluminum Nitride and Silver Plated Chopped Carbon Fiber to Prepare Electrically Conductive Adhesives with High Thermal Conductivity

Abstract

To satisfy the high electrical and thermal conductivity required for the development of microelectronic products, silver plated aluminum nitride (Ag/AlN) and silver plated chopped carbon fiber (Ag/CF) were added into an acrylate resin to prepare electrically conductive adhesives (ECAs) with high thermal conductivity. The Ag/AlN was prepared by subjecting AlN to an electroless silver plating using a Pb-free activation method. The Ag/AlN has good electrical and thermal conductivity compared to the AlN without treatment. When the weight fraction of Ag/AlN is 45 ωt%, the electrical conductivity of ECAs based on acrylate resin filled with Ag/AlN is 1.5 S/cm, and the thermal conductivity reaches 2.1 W/(m · K). With the addition of 3 ωt% Ag/CF as supplement filler, the electrical conductivity has a sharp increase to 17.8 S/cm because of the formation of conductive networks in the ECAs. However, the shear strength has an apparent loss, falling from 4.2 to 1.1 MPa.