Abstract

The Infrared Astronomy Satellite (IRAS) carries infrared detectors which must operate at temperatures of about 3K [1]. Cold testing showed that the copper thermal straps which conduct the heat from the focal plane assembly (FPA) might have inadequate thermal conductance at the electrically insulated thermal joint due to the small area of the joint and the fact that the joint must be electrically insulated. In addition, the repeatability of the joint conductance after disassembly and reassembly could not be assured. A backup joint design has been developed and its performance tested in the lab. The thermal performance and imperative electrical isolation proved to be reliable and met the thermal requirements. The modified thermal strap joint attachment was incorporated into IRAS flight hardware FPA. Cold tests proved the thermal strap joint performs the desired function and keeps the IR detectors at temperatures below 3K as needed.

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