Electrical resistivity feature of Cu–Sn–(Bi) alloy melts

Abstract

The temperature dependence of electrical resistivity of Cu–Sn alloys, along with Cu–Sn–Bi alloys, has been investigated in a wide temperature range using the DC four-probe technique. Evidently abnormal changes are observed on ρ–T curves of these alloys. The result reveals that the irreversible and reversible changes on these ρ–Tcurves indicate the existence of the metastable microinhomogeneous structure and microheterogeneous structure (including some short range orders) of the Cu–Sn and Cu–Sn–Bi alloy melts, respectively. Furthermore, the addition of Bi increases the metastable microheterogeneity in the first heating process of Cu–Sn melts.