Abstract

Bi3.2Gd0.8Ti3O12 (BGTO) thin films were deposited on Pt(111)/Ti/SiO2/Si(100) substrates using the sol-gel method and rapid thermal annealing in an oxygen atmosphere. The effects of annealing temperature (500–800°C) on microstructure and electrical properties of thin films were investigated. X-ray diffraction analysis shows that the BGT thin films have a bismuth-layered perovskite structure with preferred (117) orientation. The intensities of (117) peaks increases with increasing annealing temperature. The leakage current density (J) was 3.69×10−8 A/cm2 at 200 kV/cm. It was found that the leakage current was affected not only by the microstructure but also by the interface between the Pt electrode and BGTO thin films. In the low electric field region, the leakage current was controlled by Poole–Frenkel emission. In addition, the mechanism can be explained by Schottky emission from the Pt electrode in the high electric field region.

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