Abstract
This paper discusses the characteristics of noise sources in Al-based thin films and their relationships to VLSI reliability. Techniques of applying noise measurements in detecting existing defects/damages in the films, determining electromigration activation energy, and predicting the time to failure of VLSI interconnects are presented. The noise measurement technique can be applied to wafer-level reliability testing because it is much faster than the conventional MTF method and is nondestructive in nature. Some important considerations for wafer-level reliability testing via noise measurements are also presented in this paper.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
