Electrical modeling, simulation and SPICE model extraction of TSVs in silicon interposer

Xin Sun Xin Sun,Min Miao Min Miao,Yunhui Zhu Yunhui Zhu,Yufeng Jin Yufeng Jin,Jing Chen Jing Chen,Shenglin Ma Shenglin Ma

doi:10.1109/eptc.2011.6184409

Electrical modeling, simulation and SPICE model extraction of TSVs in silicon interposer

Xin Sun Xin Sun, Min Miao Min Miao + Show 4 more

https://doi.org/10.1109/eptc.2011.6184409

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Publication Date: Dec 1, 2011

Citations: 4

Affiliation: Beijing Information Science & Technology University, Peking University

#Through Silicon Via #Modeling Of Through Silicon Via + Show 8 more

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Abstract

In this paper, electrical characteristic of TSV (Through Silicon Via) is analyzed. Firstly, equivalent circuit model of TSV is summarized. Modeling and electrical analysis of TSV is conducted, in which TSVs with ideal and non-ideal profiles are compared. And then, multi-TSV configuration in silicon interposer is modeled and analyzed. Capacitive and inductive coupling between TSVs are simulated. With these analyses, solutions to decrease crosstalk between TSVs are proposed.

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