Abstract
We present a thorough investigation into mechanisms to improve the wirebonding yield onto thick SU-8 MEMS structures and actuators using optimized processing conditions. The failure modes of electrical connections onto SU-8 structures have been determined and minimized through our investigations into device yield and bond strength. Primary failure modes of ball bonding are metal delamination from the SU-8 surface and plastic deformation of thicker structures at elevated ball bonding temperatures. Both failure modes can be reduced significantly by using hardbaking steps and surface activations prior to metal depositions. The best bonding results are achieved when micro-roughening of SU-8 is combined with a surface activation to improve metal adhesion to the SU-8 surface. SU-8 thermal actuators up to 40 µm thick have been successfully bonded and operated on a polymer MEMS chip to demonstrate a potential application.
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