Abstract
We present the first successful wirebonding on thick SU-8 actuators reported in the literature with a thorough investigation to determine the best processing conditions to produce reliable electrical connections to SU-8 MEMS structures. We measured the yield and mechanical strength of gold ball bonds for a variety of processing conditions on SU-8 structures up to 100 μm thick covered with a thin gold layer. Optimized processing conditions result in ball bonds with high adhesion strength and very low contact resistance. Multiple SU-8 based actuators have been electrically connected and operated demonstrating high reliability and yield.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
