Abstract
Gate oxide integrity (GOI) tests, surface photovoltage and deep level transient spectroscopy of Czochralski silicon wafers reveal oxide degradation at heavy precipitation, defect-controlled recombination lifetime and defect-induced deep levels. Electron beam induced current measurements on those wafers before and after intentional metal decoration reveal relatively shallow levels in the non-decorated state and deep levels in the decorated state. It is shown that the actual contamination level determines the usefulness of GOI tests for predicting material performance in device processing.
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