Abstract
HfO2 films have been deposited on hydrogen-terminated diamond (H-diamond) by an atomic layer deposition (ALD) technique at 120 °C. Effect of rapid thermal annealing treatment on electrical properties of Au/Ti/Pd/ALD-HfO2/H-diamond metal-oxide-semiconductor (MOS) diodes has been investigated. The leakage current density of the MOS diode after annealing at 300 °C is as small as 10−8 A/cm2 at gate biases from −5.0 to 4.0 V. The capacitance-voltage curve in the depletion mode of the MOS diode after annealing is much sharper than that of the MOS diode before annealing and close to the theoretical dependence, which indicates the small interface state density. The annealed MOS diode is concluded to be more suitable for the fabrication of field effect transistors.
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