Electrical characteristics assessment and noise analysis of pocket-doped multi source T-shaped gate tunnel FET

Abstract

A detailed analysis of a novel multi-source T-shaped gate Tunnel FET (MS-TTFET) is presented in this study in order to address the main issues with conventional TFETs. Due to its exceptionally low off-state current (IOFF) and remarkable sub-threshold properties, the tunnel field effect transistor has received a great deal of interest for low standby power applications. The MSR's integration into the SOI platform increases the device's on current, which increases the effective tunnelling area in the middle of the source-channel junctions. An isolator oxide has been added to prevent the source and drain regions from being directly coupled. A SiGe pocket has been suggested at the source and channel junction; silicon-germanium, a low bandgap material which enhances the tunnelling of charge carriers. A T-shaped gate can increase the effectiveness of the tunnel junction in order to limit the lower value of the leakage current. The multi-source regions of the T-shaped gate tunnel field effect transistor can boost the on-state current (ION) by improving tunnel junction areas. The device's ION/IOFF ratio, which is 1013 for our suggested construction, is the standard measure of merit for any device. It is possible to achieve an increased ON current of the order of 10−5 A/μm with a negligible subthreshold swing (SS) of 42 mV/decade. Moreover, the effect of low frequency flicker noise on the device behavior has been investigated.