Abstract
The phenomenon of constrained sintering, where large rigid inclusions of alumina have been shown to significantly reduce the rate of sintering of titania [Bordia and Raj (1988) J. Am. Ceram. Soc. 71, 302–310], is shown to subside nearly completely during flash sintering carried out under modest electrical fields. The result is explained by a different mechanism for volumetric and shear deformation under electric fields. It is proposed that vacancy and interstitials generated within the grains migrate to grain boundaries and pores to produce both volumetric and shear strain at equal rates, since, in this way, the diffusion distance for both modes of deformation becomes the same. In conventional sintering, where transport occurs from one interface to another, the diffusion distance for shear is twice as far as for densification, which retards sintering should it become controlled by shear deformation, as seen in constrained sintering.
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