Abstract
We propose a new method to form solid, silicon-containing, substrate-supported films with ordered cylindrical pores. Such films may be used as low-dielectric-constant interlayers in microelectronics. First, liquid films are obtained in a plane-parallel glass capillary, using a precursor solution of the worm-like micelles as a template. An ac electric field of the order of 104 V/cm is applied to orient the micelles in one direction. Further on, after solidification of the precursor solution under the field and its calcination in a vacuum furnace, solid dielectric films are formed. These films possess high mechanical modulus and are expected to have low dielectric constants.
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