Abstract
AbstractThe three‐dimensional (3‐D) problem of bi‐materials or two ideally bonded elastic half‐spaces with interacting sub‐interface cracks subjected to time‐harmonic loading is analyzed. The boundary value problem is reduced to a system of boundary integral equations (BIEs) in the frequency domain for the crack‐opening‐displacements (CODs) only. Boundary integrals over the finite crack‐surfaces are obtained by introducing modified elastodynamic Green's functions, which identically satisfy the contact conditions on the infinite interface. The singularity subtraction technique under consideration of the ‘square‐root’ behavior of the CODs at the crack‐front is applied for the regularization of the BIEs. By using a collocation scheme, the BIEs are converted into a system of linear algebraic equations. Numerical calculations are performed for a bi‐material with two penny‐shaped cracks located on both sides of the interface subjected to time‐harmonic tensile loading of constant amplitude on the crack‐surfaces. Numerical results for the mode‐I dynamic stress intensity factor as a function of the wave number are presented and discussed for various material combinations and distances between the interface and the cracks. Copyright © 2009 John Wiley & Sons, Ltd.
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