Abstract
The elastic properties of siloxane spin-on glass films have been analyzed in order to achieve a characterization of this dielectric material, widely used in the technology of integrated circuits. Measurements of the biaxial stress as a function of time after deposition have shown that water inclusion strongly affects the intrinsic stress of the film, which is tensile in the as-deposited state and becomes compressive after a few days. Brillouin light scattering has then been used to determine the phase velocity of the Rayleigh and Sezawa acoustic modes in films with different thicknesses deposited on (100)-Si, leading to the evaluation of the elastic stiffness constants, of the Poisson’s ratio and of the Young’s modulus.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
