Abstract
The elastic properties of siloxane spin-on glass films have been analyzed in order to achieve a characterization of this dielectric material, widely used in the technology of integrated circuits. Measurements of the biaxial stress as a function of time after deposition have shown that water inclusion strongly affects the intrinsic stress of the film, which is tensile in the as-deposited state and becomes compressive after a few days. Brillouin light scattering has then been used to determine the phase velocity of the Rayleigh and Sezawa acoustic modes in films with different thicknesses deposited on (100)-Si, leading to the evaluation of the elastic stiffness constants, of the Poisson’s ratio and of the Young’s modulus.
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