Abstract
The solder‐joint reliability of solder‐bumped wafer level chip scale package (WLCSP) on microvia build‐up printed circuit board (PCB) subjected to thermal cycling conditions is investigated in this study. The 62Sn36Pb2Ag solder joints are assumed to be: an elastic material; an elastic‐plastic material; and a creep material which obey the Garofalo‐Arrhenius steady‐state creep constitutive law. The stress and strain in the corner solder joint of the WLCSP assembly are presented and compared for these three material models. Also, the results presented herein will be compared with that from creep analysis of the WLCSP on PCB without microvia build‐up layer.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
