Abstract
This study presents the design and fabrication of a novel series feed array antenna structure consisting of eight elements, each integrated with 0.5mm air vias and separated by 0.9mm distances. The research investigates the impact of air vias on millimeter wave 5G applications, utilizing Roger 5880 substrate (εr = 2.2, loss tangent = 0.0009, thickness = 0.508mm) for resonance within the 26-28 GHz range. The inclusion of air vias demonstrates a reduction in interference, evidenced by changes in current density, surface current distribution, and VSWR. The antennas, configured with 20 x 60 mm substrates and λ/2 element spacing, exhibit improved return loss (32 dB to 38 dB) and closer alignment with desired VSWR values upon integrating air vias. The study also reveals heightened surface current and density at the radiating element edges due to the vias' dielectric properties. Computational simulations utilizing CST studio validate the structural designs.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
