Effects of ultrasonic vibration on filling behaviours in micro-embossing processes

Abstract

To improve the quality of patterning used in optical system and biological detection, a serial of ultrasonic assisted micro-embossing experiments were carried out at room temperature using silicon moulds with different groove widths. Effects of acoustic energy and application time were investigated. The filling ratio increases with the increasing of acoustic energy, however, it decreases after 55%. And, filling ratio at room temperature with ultrasonic vibration is bigger than that of hot embossing without vibration when the groove width is bigger than 80μm. This means that ultrasonic vibration is helpful for increasing the filling ratio under a suitable condition.