Abstract
The effects that film thickness has on the length scale over which dislocation motion takes place were studied to elucidate the origin of the thickness dependence of the strength of polycrystalline Ag thin films on substrates. At low temperatures (below 200°C), where dislocation-mediated plasticity is the dominant inelastic mechanism, the thickness dependence of two plasticity parameters, the activation volume and the length of mobile dislocation segments, was investigated. The experimental results indicate that the distance between pinning points along the length of mobile dislocations increases with film thickness, and that it is significantly smaller than the film thickness and the average grain size. The thickness-dependence of the length over which individual inelastic events occur, which is the characteristic length scale for dislocation plasticity, clarifies the origin of the dependence of the low-temperature strength of thin films on film thickness.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.