Abstract
Electroplated nickel has been known to have brittle fracture problem and the phenomena originated from the fact that the nickel films contained small amounts of impurities such as hydrogen, sulfur and phosphorus which enabled plating process and improved mechanical properties (hardness) through grain refinement effect. In this study, correlation between the impurities and brittle fractures of electroplated nickel films were systematically investigated at temperature range of 673–973K. Experimental results showed that the fracture toughnesses were closely related with the microstructures of the nickel films and their impurity content. The measured KC values were ranged between 2.0 and 4.5, which were one order of magnitude lower than those of pure nickel. Activation energy for the grain growth of the nickel films was determined as 234KJ/mole.
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