Abstract
Microhardness and sound velocity were measured in case of differently prepared solder samples. The used Pb-10Sn solder samples were melted then cooled down applying different cooling rates. These procedures caused variant microstructure thus different microhardness and sound velocity values. The sound velocity was measured by means of scanning acoustic microscopy. Characterization of solder materials by acoustic microscopy gives the possibility to non-destructively estimate mechanical and reliability parameters of the given material.
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