Abstract
The effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024Al composites sheet were investigated at 853 K (580 °C) using a mixed slurry of Al, Cu, and Ti powder interlayer. The process parameters were as follows: the pulse current density of 1.15 × 102 A/mm2, the original pressure of 0.5 MPa, the vacuum of 1.3 × 10−3 Pa, and the bonding time from 15 to 60 minutes. Moreover, the bonding mechanism in correlation with the microstructural and mechanical properties variation was analyzed.
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