Abstract
AbstractWe have investigated the effect of organic additives on electroplated nickel‐copper thin films. The plating electrolyte utilized mixtures of copper sulfate and nickel sulfamate. The electrolyte contained small volumes of an appropriate organic additive known as an accelerator. By simply adding an additive, we could vary the concentration of copper between 5 and 15%. Thin films of nickel‐copper prepared from the electrolyte containing the additive have also shown alteration of crystalline orientations and increase of magnetoresistance from ∼0.55% to ∼1%. This method has advantage of controlling the composition of the co‐deposited nickel‐copper without changes in deposition conditions and inducing a change in magnetoresistance. (© 2004 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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