Abstract
High-temperature bonding, or joining, is a key technology for electronic component assembly and other high- temperature applications. Recently, focusing on the sintering behavior of nanoparticles, the joining process using a nanoparticle paste has been proposed as an alternative to soldering for high-temperature applications. In this study, Cu nanoparticle paste was used to join two Cu discs, and the effect of joining conditions on the joint strength of the Cu-to-Cu joint was investigated. Joining using Cu nanoparticle paste was successfully achieved, but the effect of joining conditions such as heating temperature and joining atmosphere on joint strength of the Cu-to-Cu joint was significant.
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