Abstract
The corrosion behavior of ternary Sn–9Zn–0.1X (X=Ni, Cr, Cu and Ag) solder alloys were investigated by electrochemical techniques and surface characterization, aiming to explore the effects of intermetallic-forming elements on the corrosion resistance. Zn-rich precipitates in the modified alloys were suppressed and refined by formation of Zn-containing intermetallic compounds. As a result, the corrosion resistance improved markedly with addition of these elements, and the potency to suppress anodic dissolution increased in the order of Ag<Cu<Cr<Ni. Such improvement was discussed in terms of refined Zn-rich precipitates and enhanced passive film stability.
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