Abstract
The formation of Intermetallic compounds (IMCs) at the interface between an Sn-9Zn-1.5Ag-xBi solder alloy and a Cu substrate dipped at 250 � C and heat-treated at 150 � C for various times has been investigated by an optical microscope (OM), an X-ray diffractometer (XRD) and a scanning electron microscope (SEM) with an energy dispersive spectrometer (EDS). The OM result shows the flat and smooth surface for the Sn9Zn-1.5Ag-1Bi solder alloy and Cu substrate after dipping at 250 � C. The phases of IMCs formed are Cu6Sn5 and Cu5Zn8 for both lead-free solder alloys. After thermal treatment at 250� C for 200 h, the phases of IMCs are Cu6Sn5 ,C u 5Zn8 and Ag3Sn. The Cu6Sn5 has a scallop morphology, and is located at the interface between the solder and Cu substrate. The adhesion strength for the Sn-9Zn-1.5Ag-1Bi lead-free solder alloy is higher than the Sn-9Zn-1.5Ag solder alloy. After being heat-treated at 150� C, the adhesion strength of the Sn-9Zn-1.5Ag-1Bi solder alloy decreases from 12:67 � 0:45 to 6:92 � 0:38 MPa after thermal treatment for 200 h. [doi:10.2320/matertrans.MRA2007075]
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