Abstract
The effects of implantation temperature (Ti) on the chemical and physical structure of annealed high-dose oxygen ion implanted layers were investigated by Auger electron spectroscopy (AES) and transmission electron microscopy (TEM). At low Ti (∼400 °C) the buried oxide is bordered by layers of polycrystalline silicon (polysilicon) which, in the top silicon layer, is separated from damaged single crystal Si by a thin band of discontinuous oxide. These polysilicon layers are formed from amorphous regions during high-temperature anneals. At high Ti (∼500 °C) polysilicon was not observed.
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