Abstract

This work investigates the effects of incomplete interfacial adhesion between polymer and nanoparticles on the predicted tensile modulus of clay/polymer nanocomposites (CPNs). The Halpin-Tsai and Hui-Shia models which assume the perfect interfacial adhesion commonly overpredict the modulus in CPN. Accordingly, the samples include imperfect interfacial bonding at polymer-filler interface. In this condition, the effective aspect ratio and volume fraction of nanoclay are defined using “Lc” as the essential distance for the normal stress to reach the clay strength and “τ” as the interfacial shear strength. The values of “Lc” and “τ” are calculated for several samples and also, their roles in the predicted modulus are determined. It is shown that low “Lc” and high “τ” result in a significant modulus, because they indicate the great levels of interfacial properties in CPN. Also, the large and thin platelets can produce a high modulus depending to the level of Interfacial parameters.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.