Abstract
This study investigates the effects of Gallium addition to the thermal behaviour and whiskers growth under electrical current stressing to the microstructure and intermetallic (IMCs) between solder and copper substrate. The samples were dipped using Sn-0.7Cu and Sn-0.7-0.05Ga solder and further continued with electromigration process for whiskers growth observation. The characterization were then analysed using Scanning Electron Microscopy (SEM) on the surface and intermetallic layer. From the observation, the addition of 0.05% Ga has lowered the melting point of Sn-0.7Cu-0.05Ga Copper and refined the microstructure. There is no indication of new phase form after 0.05%Ga addition. Furthermore, whiskers were observed to grow at both Sn-0.7Cu and Sn- 0.7Cu-0.05Ga. However, the whiskers growth on both cathode and anode sides have been reduced with the Ga addition. It is also observed that the hardness increased with the addition of Ga element to the solder.
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