Abstract
Many studies have investigated Ni-Sn alloy because it has good luster and excellent corrosion resistance. Electroplating methods have already reached a practical level of applicability, but electroless plating methods have not reached such a degree of utility because they present difficulties such as insufficient film thickness and low Sn content in the deposited film. Therefore, we fixed the bath temperature and stirring under the operating conditions and studied details of the plating bath composition to deposit a film with a high Sn content of 50 wt% or more using electroless plating.
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