Effects of Diamond Content on the Thermal Conductivity of Copper Matrix Composite Materials Prepared by Cold Spraying

Abstract

With the increasing demand for rapid heat transfer in electronic packaging materials, quickly transferring the large amount of heat generated is an urgent problem that needs to be solved in current electronic information manufacturing. Diamond is added to copper based composite materials to further improve the thermal conductivity of electronic packaging materials. In this paper, copper matrix composite materials were selected as the research object, and the effects of diamond content on the microstructure and thermal conductivity were systematically investigated. As the content of copper plated diamond in the mixed powder increases, the proportion of copper plated diamond in copper based composite materials gradually increases, but the deposited copper plated diamond exhibits fragmentation phenomenon. Increasing the content of copper plated diamond leads to a rapid decrease in thermal conductivity, and subsequent process optimization and heat treatment are needed to unleash the thermal conductivity of diamond.