Electronic Packaging Materials and Their Functions in Thermal Managements

Abstract

Advanced electronic packaging materials play a key role in the proper functioning and useful life of the packaged electronic assembly. These functions mainly include electrical conduction, electrical insulation, mechanical support and structural profiles, environmental protection, as well as thermal conduction and dissipation. Therefore, electronic packaging materials shall possess required electrical, mechanical, thermal, chemical, and physical properties to provide the electronic system with excellent performance and reliable functions. For example, metals provide the means for conducting signals throughout the system via thin-film conductors, wires, interconnects, vias, etc.; insulating materials are used to prevent loss of signal currents by confining them to the metal path; structural or multifunctional materials are used to provide physical functions and mechanical support; and there are materials in which the primary function is for thermal dissipation or to prevent the system from the environment. This chapter will provide an overall review for the state of the art of high-performance electronic packaging materials and their thermal management functions, including properties of key materials, state of maturity, applications, processing, and future directions. These materials mainly include metallic materials, ceramics and semiconductors, electronic glasses, polymers, multimaterial laminates, printed circuit board (PCB) materials, thermal interconnection materials, low thermal conductivity materials, and advanced thermally conductive materials.