Abstract

For the solder balls used in advanced filp-chip technology, SnAg is one of the most promising materials to replace the conventional SnPb solder which is harmful to environment. During the two-step electroplating process of SnAg solder, the divergence of electrode potential between Sn2+ and Ag+ often leads to the appearance of undesirable voids. Two decisive parameters that play an important role on solder voids, current density and concentration of Sn2+, were evaluated in this paper. The results of X-ray observation suggested that relatively lower current density and higher concentration of Sn2+ would help to reduce the voids and then improve reliability. In addition, a simple mechanism of the effects of current density and concentration of Sn2+ on void formation was proposed, which provided guidance for industrial production.

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