Abstract
Ti–Cu–N films containing approximately 0–10 at. % Cu were deposited on Si(100) substrates with high-density low-energy ion flux irradiation by inductively coupled plasma (ICP)-assisted magnetron sputtering. The effects of Cu doping on film microstructures, morphology and properties were investigated. The addition of a small amount of Cu markedly modified the preferred orientation and morphology, and significantly increased film hardness. A Ti–Cu–N film containing 2 at. % Cu has a maximum hardness of approximately 42 GPa. This film was characterized as having a nanocomposite structure, consisting of nanocolumns of TiN crystallites with very small Cu crystallites inside the column boundaries. The hardness increase was attributed to a nanocomposite effect.
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