Abstract
The effects of Bi addition, of less than 3 wt.%, and applied cooling rate on the solidified microstructure of the eutectic Sn–3.7Ag–0.9Zn (weight percent, hereafter) solder were investigated. As observed by microstructural analysis, the increase of Bi content favors the separation of the β-Sn and AgZn intermetallic compounds (IMCs) in the eutectic Sn–Ag–Zn solder. And there are some Bi precipitates formed along with the primary β-Sn dendrites as the concentration of Bi exceeds 2%. As the applied cooling rate increases, the microstructure of the Sn–3.7Ag–0.9Zn–Bi solder is refined, and the segregation of Bi is restrained. By increasing the amount of Bi, the microhardness of the solder increases.
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