Abstract
The effects of different bonding pressure during flip-chip-on-flex (FCOF) assembly in relation to the performance of anisotropic conductive film (ACF) interconnect were investigated. Two types of ACF were used in this study. ACF 1 is designed to create good interconnection when the connecting bumps and pads are in close contact while ACF 2 can give good connections when the conductive particles are in contact with the bumps and pads, hence the deformation of conductive particles within ACF 2 FCOF packages were less than that within ACF 1 packages. ACF 2 gave much better interconnection performance when compared to ACF 1 indicating that ACF 2 is more flexible and can tolerate a wider range of bonding pressure.
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