Effects of annealing on antiwear and antibacteria behaviors of TaN–Cu nanocomposite thin films

Abstract

TaN–Cu nanocomposite films were deposited by reactive cosputtering on Si and tool steel substrates. The films were then annealed using rapid thermal annealing (RTA) at 400°C for 2, 4, and 8min, respectively, to induce the nucleation and growth of Cu particles in TaN matrix and on film surface. Field emission scanning electron microscopy was applied to characterize Cu nanoparticles emerged on the surface of TaN–Cu thin films. The effects of annealing on the antiwear and antibacterial properties of these films were studied. The results reveal that annealing by RTA can cause Cu nanoparticles to form on the TaN surface. Consequently, the tribological behaviors, as well as the antibacterial behavior may vary depending on particle size, particle distribution, and total exposed Cu amount. For the samples with large Cu particles, the reduction of averaged friction and wear rate is obvious. Apparently, it is due to the smeared Cu particles adhered onto the wear tracks. This Cu layer may act as a solid lubricant. From the antibacterial testing results, it is found that both Cu particle size and total exposed Cu amount are critical in making short-term antibacterial effect. Overall, all the annealed TaN–Cu samples can reach >99% antibacterial efficiency in 24h, with respect to uncoated Si substrate.