Abstract
The thermal behavior, microstructure and mechanical properties of the modified lead-free Zn–30Sn–xAl (x = 0, 0.1, 0.5, 1.0 wt%) composite solder alloys had been investigated in the present study. Addition of Al tended to refine the microstructure and decrease the melting point. The analysis of microstructure showed that the supersaturated precipitation of Al (0.5 wt%) in η-Zn phase would result in the formation of Zn–Al phase. Due to the peritectic reaction, the Zn–Sn–Al phase was observed when the Al content was 1 wt%. The refinement of eutectic structure and η-Zn phase improved the elongation when the minor Al element (0.1 and 0.5 wt%) was added into Zn–30Sn solder. However, when the Al content was 1.0 wt%, the elongation of Zn–30Sn-based solder decreased because of the stress concentration. Besides, the ultimate tensile strength (UTS) of the alloy increased from 45.48 to 91.26 MPa, and the yield strength increased from 35.26 to 37.53 MPa. The analysis of the fractography showed that the brittle fracture gradually turned into mixed fracture mode of ductile fracture and ductile fracture with the increasing content of Al.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
