Abstract
The present study investigates the influence of Ce addition on the thermal behavior, microstructure, and mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The intermetallic compound (IMC) layer evolution and shear strength of SAC305-xCe solder joints were also studied under different aging processes. Four different alloys with Ce concentrations ranging from 0 wt% to 0.5 wt% were prepared by vacuum induction melting, followed by pouring into a steel mold and cooling to room temperature. The microstructure was characterized using optical microscopy, scanning electron microscopy, X-ray diffraction analysis and electron probe microanalysis, tensile and shear tests were conducted to evaluate the mechanical properties of the solder alloys and solder joints. The results show that the addition of Ce can refine the microstructure and improve the tensile strength of SAC305 alloys. The joints fabricated with Ce-bearing alloys possessed thinner IMC layers and slower IMC growth rate, and exhibited higher shear strength. Moreover, the addition of Ce can facilitate the aggregation of nano-Ag3Sn particles on the surface of Cu6Sn5 particles at the interface between the solder alloy and the Cu substrate. These Ag3Sn particles can act as small connection skeletons and contribute to strengthening the solder joints. The best mechanical performance during both reflowing and isothermal aging was achieved for SAC305 joints with a Ce concentration of 0.15 wt%.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
