Abstract
This study investigated the changes in dielectric properties of the disc capacitor and base metal electrode (BME) multilayer ceramic capacitor (MLCC) fabricated from the host material (BaTiO3 + 1.0 mol% MgO + 0.05 mol% MnCO3 + 1.37 mol% BaSiO3) with different amounts of Sc2O3 addition. The results of transmission electron microscope (TEM) analysis verified that the addition of 0.6 mol% Sc2O3 led to the formation of a grain core–shell structure. The formation of the grain core–shell structure can improve the temperature stability of the dielectric properties. The presence of Sc2O3 can increase the room-temperature insulation resistance and reduce dielectric loss (tanδ); however, an excessive addition of Sc2O3 resulted in the decline of the insulating property of MLCCs at a high temperature. This study revealed that the temperature coefficient of the capacitance (TCC) curves can be flattened by adding 0.3–0.6 mol% Sc2O3 into the host material so that the developed BME MLCCs can comply with the requirements of the Electronic Industries Alliance (EIA) X8R specification. In particular, the MLCC with 0.3 mol% Sc2O3 addition had satisfactory TCC stability and insulating properties; the dielectric constant was 2084, tanδ was 1.23%, the TCC at −55 °C and 150 °C was −2.8% and −5.8%, respectively, and the insulation resistance at −55 °C and 150 °C was 3.6 × 1010 Ω and 2.6 × 107 Ω, respectively.
Published Version
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